Plastic and Ceramic IC Package Inventory

Global Chip Materials offers an extensive inventory of industry standard plastic and ceramic packaging for microelectronic assembly. Cost-effective and reliable, NTK and Kyocera ceramic packages are on-shelf in hundreds of popular sizes and configurations. We now offer the same benefits in our new line of Pre-Molded Open Cavity Plastic Packages. Select from the links below to review product data and submit a RFQ.

Ceramic Package Inventory
 

Ceramic Side Braze / DIP

 
 

Ceramic Leadless Chip Carrier LCC

 
 

Ceramic Leaded Chip Carrier CQFJ

 
 

Ceramic Pin Grid Array
CPGA

 
 

Ceramic Quad Flat Package / Cerquad CQFP

 
 

Ceramic SOIC

 
 
Open Cavity Plastic Package Inventory
 

Plastic Open Cavity
SOP / SOIC / SSOP

 
 

Plastic Open Cavity PLCC

 
 

Plastic Open Cavity
PQFP / TQFP / LQFP

 
 

Plastic Open Cavity
QFN (Quad Flat No-Lead)

 
Lids and Covers
 

Metal Combo Lids

 
 

Ceramic Lids — Glass / Epoxy

 
Global Chip Materials • www.globalchipmaterials.com • Phone 916.853.9300 • Fax 916.853.1274

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