Global Chip Materials now manufactures a
new line of cost effective Plastic IC Packaging in open cavity configurations.
An ideal solution
for quick-turn onshore assembly
of new prototype devices, these packages are JEDEC standard compliant and
replicate
the footprint as well as electrical and mechanical characteristics of their
production counterparts.
Our pre-molded open cavity IC package is production
quality, with none of the assembly disadvantages or yield issues that
are typical of packages that have
been “reworked”. All packages are gold plated to military specifications
to insure reliable wire bonds, robust die adhesion and extended shelf life.
Compatible with standard, in-house assembly methods, our premolded plastic
packages are
a cost-effective and reliable option.
Open Cavity plastic packaging allows the
exposed die to be easily debugged, probed, or FIBBED. Open Cavity packages
are also ideal for applications such
as MEMS,
Optoelectronics, and Sensors and can be easily sealed using epoxy-coated
plastic, LCP, or glass lids. |
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