Pre-molded Open Cavity Plastic Packages

 
Open Cavity Plastic Package Features
  • New, pre-molded — not reworked!
  • Replicates production package
  • Au plated for extended shelf life
  • Uses standard assembly methods
  • Ideal for rapid prototypes, engineering “hot lots,” and customer samples
  • Test, probe, or FIB new IC designs
  • JEDEC standard compliant
Ready-to-Use! Order today, assemble tomorrow!

Global Chip Materials now manufactures a new line of cost effective Plastic IC Packaging in open cavity configurations. An ideal solution for quick-turn onshore assembly of new prototype devices, these packages are JEDEC standard compliant and replicate the footprint as well as electrical and mechanical characteristics of their production counterparts.

Our pre-molded open cavity IC package is production quality, with none of the assembly disadvantages or yield issues that are typical of packages that have been “reworked”. All packages are gold plated to military specifications to insure reliable wire bonds, robust die adhesion and extended shelf life. Compatible with standard, in-house assembly methods, our premolded plastic packages are a cost-effective and reliable option.

Open Cavity plastic packaging allows the exposed die to be easily debugged, probed, or FIBBED. Open Cavity packages are also ideal for applications such as MEMS, Optoelectronics, and Sensors and can be easily sealed using epoxy-coated plastic, LCP, or glass lids.

 
Open Cavity Plastic Package Availability
 

Plastic Open Cavity
SOP / SOIC / SSOP

 
 

Plastic Open Cavity PLCC

 
 

Plastic Open Cavity
PQFP / LQFP

 
 

Plastic Open Cavity
QFN (Quad Flat No-Lead)

 
Global Chip Materials • www.globalchipmaterials.com • Phone 916.853.9300 • Fax 916.853.1274

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