Ceramic Package Inquiry Form

             

Global Chip Materials staff of ceramic packaging experts can assist you in finding the right package for your application. We have over 15 years of experience working with users of IC packaging materials.

Please provide us with the information below so that we may accurately understand your requirements. We will respond promptly.

       
         
  First Name
Last Name 
Title/Position 
Company 
Phone 
E-mail 
Package Type 
Lead Count 
Die Size (Optional) 
Cavity Size 
Mfg. Drawing # (Optional) 
Quantity 
Date Required 
Other Requirements
or Comments 
 

 

       

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