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Ceramic SOIC |
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The SOIC is an ideal package for telecommunication, automotive, and other applications that require dense placement of chips on boards. It is a surface mount package with .050" lead spacing. Ceramic SOICs are currently only manufactured in 16, 20, 24, and 28 lead configurations.
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| NAME OF PACKAGE |
GCM PART # |  |
MFG. PART # | CAVITY SIZE |
PHOTO | DRWG. | LEAD FORM |
BODY SIZE W x L |
THICKNESS (t1/t2/Total) |
BOND LAY-OUT |
COMBO LID |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 16 SOIC | SO16172801 | RFQ | REGISTER | .170 x .283 | JPG | Z | .293 x .411 | .015/025/.085 | 2 x 6 | REGISTER | |
| 20 SOIC | SO20172801 | RFQ | REGISTER | .170 x .283 | JPG | Z | .293 x .504 | .015/.025/.085 | 4 x 6 | REGISTER | |
| 24 SOIC | SO24172801 | RFQ | REGISTER | .170 x .283 | JPG | Z | .293 x .606 | .015/.025/.085 | 6 x 6 | REGISTER | |
| 28 SOIC | SO28172801 | RFQ | REGISTER | .170 x .283 | JPG | Z | .293 x .706 | .015/.025/.085 | 6 x 8 | REGISTER |
