Open Cavity Plastic SOIC Package

Global Chip Materials manufactures a variety of Small Outline IC packages in plastic open cavity configurations. An ideal quick-turn assembly solution, these surface mount packages replicate the footprint and performance of their production counterparts. They feature gold plated die pad, bond fingers, and external leads. These packages have gull-wing formed leads and are available in body widths of 150 and 300 mils. Some configurations are available with E-Pads for increased heat dissipation in high frequency applications.

More Info On Pre-molded Packages

 
SOP / SOIC / SSOP Configuration Options (Dimensions in inches)
BODY WIDTH LEAD COUNT LEAD PITCH DIE PAD SIZE BODY THICKNESS JEDEC SPEC PART NUMBER REQUEST QUOTE
.150 8 .050 .075 x .100 .055 MS-012 SO08071001 Quote
.150 8 .050 .085 x .120 .055 MS-012 SO08081201 Quote
.150 14 .050 .075 x .100 .055 MS-012 SO14071101 Quote
.150 16 .025 .075 x .100 .055 M0-137 SSOP16071001 Quote
.150 16 .050 .075 x .120 .055 MS-012 SO16071201 Quote
.300 16 .050 .150 x .220 .093 MS-013 SO16152201 Quote
.300 20 .050 .150 x .220 .093 MS-013 SO20152201 Quote
.300 24 .050 .150 x .220 .093 MS-013 SO24152201 Quote
.300 28 .050 .160 x .230 .093 MS-013 SO28162301 Quote

Contact us today for detailed information including technical specs, drawings, and part photos!



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